R9A06G037GNP#AA0

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Manufacturer	Renesas Electronics America Inc
Category	System On Chip (SoC)
Mfr. Part #	R9A06G037GNP#AA0
Description	SOC PLC MODEM LSI SMART GRID ASS
Details Description	ARM® Cortex®-M3 System On Chip (SOC) IC – 138MHz 64-HVQFN (9×9)
Package	64-VFQFN Exposed Pad
Listed Quantity*	33135

Datasheet: datasheet

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Catalog Technical Specifications

Use these catalog details for an initial review. Confirm the exact ordering code, current lifecycle status and manufacturer datasheet before design approval or purchasing.

Description

Mfr

Renesas Electronics America Inc

Series

–

Package

Tray

Product Status

Active

Architecture

DSP, MCU

Core Processor

ARM® Cortex®-M3

Flash Size

–

RAM Size

128kB

Peripherals

PWM

Connectivity

CSI, I²C, UART

Speed

138MHz

Primary Attributes

–

Operating Temperature

-40°C ~ 85°C (TA)

Package / Case

64-VFQFN Exposed Pad

Supplier Device Package

64-HVQFN (9×9)

Number of I/O

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Yes. OrinewPCB supplies only 100% new, original, genuine electronic components. We do not supply used, refurbished or remarked material. This commitment also covers the components we supply for customers’ turnkey PCB assembly builds.

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Yes. We work with component manufacturers and distribution partners to review sourcing options beyond our substantial inventory. Send the exact part number and quantity so pricing, availability and delivery can be confirmed for your request.

Does a listed quantity confirm immediate delivery?

Confirm the current available quantity, packaging, any date/lot requirements and delivery date in your quotation. Directory counts and listed quantities do not reserve material or confirm that every listed item is currently in our own warehouse.

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Yes. Send the BOM together with matching PCB design files and build quantity. State whether you need components only, partial turnkey or full turnkey PCB assembly, and identify programming and testing requirements.

Will you change a part number without our approval?

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R9A06G037GNP#AA0

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Catalog Technical Specifications

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