Post-Reflow AOI: Defects, Limits & PCBA Inspection Checklist
Define post-reflow AOI coverage before your PCBA build: visible defects, hidden-joint limits, review steps and an inspection-ready turnkey quotation checklist.
Pre-reflow AOI: a tool to improve product yield
Pre-reflow AOI can improve product yield in PCB SMT assembly. Therefore, this article describes the image processing technology principle, inspection items, application advantages, etc. of Pre-reflow AOI.
Gluing and pouring glue methods for SMT assembly
The article mainly describes the gluing and pouring glue in SMT assembly from the aspects of gluing methods, types, processes, applications, etc.
SPI Testing Principle and Application
The article describes SPI testing from the perspective of testing purpose, methods, principles, advantages, and disadvantages.
SMT material baking: prevent welding defects and extend product life
The article mainly talks about the importance of SMT material baking. It is mainly reflected in the purpose, steps, precautions, etc. of SMT material baking.
Contents And Requirements Of PCB Assembly Process Review
This article describes the content and requirements of the PCB assembly process review from process documents, fixtures, first board prototypes, etc.
Comprehensive application of AOI technology in SMT
This article mainly describes the application of AOI technology in SMT manufacturing， from printing, mounting, welding, etc.
PCB BOM List
This article discusses the audit of the PCB BOM list and reviews precautions and common problem solution plans.
PCBA X-ray inspection: advantages of non-destructive testing
This article mainly talks about the advantages of X-ray non-destructive testing and the application of X-ray testing in PCBA.
FCT Testing Equipment
This article mainly discusses the FCT test equipment's composition, types, and test indicators.
