LOW COST AUDIO BUS SLAVE REV 0.1
IC ANALOG SWITCH WLCSP
IC AUDIO SWITCH 2-IN/1-OUT 8DMP
IC AUDIO SIGNAL PROCESSOR 64SQFP
HEADSET JACK DETECTION IC WITH A
DEVELOPMENT
IC AUDIO SWITCH 23IN/1-OUT 8SSOP
ULTRA LOW POWER AUDIO CODEC
IC LINE DRIVER SMD
AUDIO CLICK-POP SUPPRESSOR
Images
Mfr.Part #
In Stock
Manufacturer
Description
Package
AD2420WCCPZ01-RL AD2420WCCPZ01-RL 49612 Analog Devices Inc. LOW COST AUDIO BUS SLAVE REV 0.1 32-WFQFN Exposed Pad, CSP
NL3S325AFCT2G NL3S325AFCT2G 13014 onsemi IC ANALOG SWITCH WLCSP Tape & Reel (TR)
NJM2520M-TE1 NJM2520M-TE1 30138 Nisshinbo Micro Devices Inc. IC AUDIO SWITCH 2-IN/1-OUT 8DMP 8-SOIC (0.197", 5.00mm Width)
BD3401KS2 BD3401KS2 33153 Rohm Semiconductor IC AUDIO SIGNAL PROCESSOR 64SQFP 64-LQFP
MAX14704EWC+T MAX14704EWC+T 22904 Analog Devices Inc./Maxim Integrated HEADSET JACK DETECTION IC WITH A 12-WFBGA, WLBGA
MAX98932DEV# MAX98932DEV# 4630 Analog Devices Inc./Maxim Integrated DEVELOPMENT Box
NJM2521V-TE2 NJM2521V-TE2 36905 Nisshinbo Micro Devices Inc. IC AUDIO SWITCH 23IN/1-OUT 8SSOP 8-LSSOP (0.173", 4.40mm Width)
MAX98090AEWJ+TW MAX98090AEWJ+TW 36845 Analog Devices Inc./Maxim Integrated ULTRA LOW POWER AUDIO CODEC 49-WFBGA, WLBGA
MAX13326AUI/V+W MAX13326AUI/V+W 14727 Analog Devices Inc./Maxim Integrated IC LINE DRIVER SMD 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
MAX9890BETA/V+ MAX9890BETA/V+ 6780 Analog Devices Inc./Maxim Integrated AUDIO CLICK-POP SUPPRESSOR 8-WDFN Exposed Pad

Audio Special Purpose

1. What are Audio Special Purpose ICs?‌

Audio Special Purpose ICs are integrated circuits designed for audio signal processing, including core functional modules such as audio codec (CODEC), digital signal processor (DSP), amplifier, mixer, etc., covering the entire link of audio signal acquisition, conversion, processing, and output. This type of chip achieves application requirements such as high-definition voice capture and multi-channel output through analog signal input, A/D conversion, digital processing (such as noise reduction and equalization), and D/A conversion.

 

2. What are the ‌Main Types of Audio Special Purpose ICs?‌

‌Audio Codec (CODEC)‌

Mainly responsible for analog-to-digital conversion (ADC) and digital-to-analog conversion (DAC), which directly affects the quality of analog input and output. For example, the AC107 chip supports multi-microphone array input and is suitable for speech recognition scenarios.

 

‌Digital Signal Processor (DSP)‌

Performs complex algorithm processing on digital audio, such as filtering, sound enhancement, etc. Some high-end models integrate independent programmable microphone bias voltage and amplifier.

 

‌Automotive Audio Processor‌

Optimized for the in-vehicle environment, such as BD37033FV-ME2 and BD37069FV-ME2 support multi-channel output (such as 6 channels), covering power management, interface control, and other functions, and adapting to the low noise and high-reliability requirements of the automotive audio system.

 

‌Power Amplifier‌

Such as the LTC6910 series, it provides high driving capability and is commonly found in portable devices and consumer electronics products. It is necessary to pay attention to the packaging form (such as SOT23-8) and the power supply voltage range.

 

3. ‌Interface and Communication Protocol of Audio Special Purpose ICs‌

‌Digital Interface Type‌

Includes I²S (mainstream audio data transmission bus), PCM (mostly used for data conversion between subsystems), and PDM (microphone recording scenarios). Among them, I²S supports left and right channel separation transmission and can work efficiently with the main control chip.

 

‌Control Interface‌

Such as the I²C bus, used for parameter configuration (such as volume adjustment).

 

4. What are Audio Special Purpose ICs Used for?‌‌

‌Consumer Electronics‌: audio processing of headphones, smart speakers, mobile phones, and other devices.

‌Automotive Electronics‌: Car audio, voice assistant, etc.

‌Industry and Communications‌: Conference systems, signal processing of voice recognition equipment.

 

5. ‌Design Points for Audio Special Purpose ICs‌

‌Power Supply and Wiring‌: Short and wide power leads should be used to reduce impedance and avoid power ripple affecting sound quality.

‌Interface Layout‌: It is recommended to place peripheral interfaces such as headphone jacks on the edge of the PCB for easy plugging and unplugging. At the same time, attention should be paid to the isolation of power supply pins (such as +5V power lines to avoid misconnection).

‌Anti-interference‌: The analog signal path needs to be separated from the digital signal to reduce crosstalk.