STEREO HEADPHONE AMPL
IC VOLUME CONTROL 20SOIC
AUDIO SOUND CONTROLLER
SURROUND PROCESSOR ICS FOR ELECT
CONSUMER CIRCUIT, PDSO20
SINGLE SIDE BAND SPEECH SCRAMBLE
AUDIO IC DEVELOPMENT TOOLS
IC SAMPLE RATE CONVERTER 28SSOP
18V OPERATION HIGH QUALITY AUDIO
IC VOLUME CONTROL 16SOIC
Images
Mfr.Part #
In Stock
Manufacturer
Description
Package
MAX9722BETE-T MAX9722BETE-T 26833 Analog Devices Inc./Maxim Integrated STEREO HEADPHONE AMPL 16-WFQFN Exposed Pad
LM1972M/NOPB LM1972M/NOPB 30262 Texas Instruments IC VOLUME CONTROL 20SOIC 20-SOIC (0.295", 7.50mm Width)
R2A15221SP#U0 R2A15221SP#U0 43193 Renesas Electronics America Inc AUDIO SOUND CONTROLLER Bulk
LV1116NV-TLM-E LV1116NV-TLM-E 26296 Sanyo SURROUND PROCESSOR ICS FOR ELECT Bulk
TCM320AC46IDW TCM320AC46IDW 14423 Texas Instruments CONSUMER CIRCUIT, PDSO20 Bulk
COM9046SOWP COM9046SOWP 40959 SMSC SINGLE SIDE BAND SPEECH SCRAMBLE Bulk
MFA100FHI33/01551 MFA100FHI33/01551 29728 NXP USA Inc. AUDIO IC DEVELOPMENT TOOLS Bulk
SRC4190IDB SRC4190IDB 35144 Texas Instruments IC SAMPLE RATE CONVERTER 28SSOP 28-SSOP (0.209", 5.30mm Width)
NJU72322V-TE1 NJU72322V-TE1 7208 Nisshinbo Micro Devices Inc. 18V OPERATION HIGH QUALITY AUDIO 32-LSSOP (0.220", 5.60mm Width)
PGA2310UA PGA2310UA 13325 Texas Instruments IC VOLUME CONTROL 16SOIC 16-SOIC (0.295", 7.50mm Width)

Audio Special Purpose

1. What are Audio Special Purpose ICs?‌

Audio Special Purpose ICs are integrated circuits designed for audio signal processing, including core functional modules such as audio codec (CODEC), digital signal processor (DSP), amplifier, mixer, etc., covering the entire link of audio signal acquisition, conversion, processing, and output. This type of chip achieves application requirements such as high-definition voice capture and multi-channel output through analog signal input, A/D conversion, digital processing (such as noise reduction and equalization), and D/A conversion.

 

2. What are the ‌Main Types of Audio Special Purpose ICs?‌

‌Audio Codec (CODEC)‌

Mainly responsible for analog-to-digital conversion (ADC) and digital-to-analog conversion (DAC), which directly affects the quality of analog input and output. For example, the AC107 chip supports multi-microphone array input and is suitable for speech recognition scenarios.

 

‌Digital Signal Processor (DSP)‌

Performs complex algorithm processing on digital audio, such as filtering, sound enhancement, etc. Some high-end models integrate independent programmable microphone bias voltage and amplifier.

 

‌Automotive Audio Processor‌

Optimized for the in-vehicle environment, such as BD37033FV-ME2 and BD37069FV-ME2 support multi-channel output (such as 6 channels), covering power management, interface control, and other functions, and adapting to the low noise and high-reliability requirements of the automotive audio system.

 

‌Power Amplifier‌

Such as the LTC6910 series, it provides high driving capability and is commonly found in portable devices and consumer electronics products. It is necessary to pay attention to the packaging form (such as SOT23-8) and the power supply voltage range.

 

3. ‌Interface and Communication Protocol of Audio Special Purpose ICs‌

‌Digital Interface Type‌

Includes I²S (mainstream audio data transmission bus), PCM (mostly used for data conversion between subsystems), and PDM (microphone recording scenarios). Among them, I²S supports left and right channel separation transmission and can work efficiently with the main control chip.

 

‌Control Interface‌

Such as the I²C bus, used for parameter configuration (such as volume adjustment).

 

4. What are Audio Special Purpose ICs Used for?‌‌

‌Consumer Electronics‌: audio processing of headphones, smart speakers, mobile phones, and other devices.

‌Automotive Electronics‌: Car audio, voice assistant, etc.

‌Industry and Communications‌: Conference systems, signal processing of voice recognition equipment.

 

5. ‌Design Points for Audio Special Purpose ICs‌

‌Power Supply and Wiring‌: Short and wide power leads should be used to reduce impedance and avoid power ripple affecting sound quality.

‌Interface Layout‌: It is recommended to place peripheral interfaces such as headphone jacks on the edge of the PCB for easy plugging and unplugging. At the same time, attention should be paid to the isolation of power supply pins (such as +5V power lines to avoid misconnection).

‌Anti-interference‌: The analog signal path needs to be separated from the digital signal to reduce crosstalk.