IC SAMPLE RATE CONVERTER 8WLCSP
IC AUDIO SIGNAL PROCESSOR 24SO
IC AUDIO TONE PROCESSOR 24SSOPA
HEADSET JACK DETECTION IC
IC AUDIO TRANSCEIVER 48LQFP
4 CHANNELS ELECTRONIC VOLUME
IC AUDIO PROCESSOR CAR 44-TQFP
IC AUDIO SIGNAL PROCESSR 40SSOPB
IC AUDIO SIGNAL PROCESSR 40SSOPB
IC AUDIO SIGNAL PROCESSR 28TSSOP
Images
Mfr.Part #
In Stock
Manufacturer
Description
Package
ADAU7002ACBZ-RL ADAU7002ACBZ-RL 34535 Analog Devices Inc. IC SAMPLE RATE CONVERTER 8WLCSP 8-UFBGA, WLCSP
E-TDA7476013TR E-TDA7476013TR 48350 STMicroelectronics IC AUDIO SIGNAL PROCESSOR 24SO 24-SOIC (0.295", 7.50mm Width)
BD37521FS-E2 BD37521FS-E2 45948 Rohm Semiconductor IC AUDIO TONE PROCESSOR 24SSOPA 24-SOP (0.213", 5.40mm Width)
MAX14628ETA+T MAX14628ETA+T 40328 Analog Devices Inc./Maxim Integrated HEADSET JACK DETECTION IC 8-WFDFN Exposed Pad
DIX9211PTR DIX9211PTR 18576 Texas Instruments IC AUDIO TRANSCEIVER 48LQFP 48-LQFP
NJU72342V-TE2 NJU72342V-TE2 632 Nisshinbo Micro Devices Inc. 4 CHANNELS ELECTRONIC VOLUME 14-LSSOP (0.173", 4.40mm Width)
TDA7717 TDA7717 11019 STMicroelectronics IC AUDIO PROCESSOR CAR 44-TQFP 44-TQFP
BD3882FV-E2 BD3882FV-E2 45323 Rohm Semiconductor IC AUDIO SIGNAL PROCESSR 40SSOPB 40-SSOP (0.213", 5.40mm Width)
BD3403FV-E2 BD3403FV-E2 48464 Rohm Semiconductor IC AUDIO SIGNAL PROCESSR 40SSOPB 40-SSOP
TDA7718 TDA7718 26253 STMicroelectronics IC AUDIO SIGNAL PROCESSR 28TSSOP 28-TSSOP (0.173", 4.40mm Width)

Audio Special Purpose

1. What are Audio Special Purpose ICs?‌

Audio Special Purpose ICs are integrated circuits designed for audio signal processing, including core functional modules such as audio codec (CODEC), digital signal processor (DSP), amplifier, mixer, etc., covering the entire link of audio signal acquisition, conversion, processing, and output. This type of chip achieves application requirements such as high-definition voice capture and multi-channel output through analog signal input, A/D conversion, digital processing (such as noise reduction and equalization), and D/A conversion.

 

2. What are the ‌Main Types of Audio Special Purpose ICs?‌

‌Audio Codec (CODEC)‌

Mainly responsible for analog-to-digital conversion (ADC) and digital-to-analog conversion (DAC), which directly affects the quality of analog input and output. For example, the AC107 chip supports multi-microphone array input and is suitable for speech recognition scenarios.

 

‌Digital Signal Processor (DSP)‌

Performs complex algorithm processing on digital audio, such as filtering, sound enhancement, etc. Some high-end models integrate independent programmable microphone bias voltage and amplifier.

 

‌Automotive Audio Processor‌

Optimized for the in-vehicle environment, such as BD37033FV-ME2 and BD37069FV-ME2 support multi-channel output (such as 6 channels), covering power management, interface control, and other functions, and adapting to the low noise and high-reliability requirements of the automotive audio system.

 

‌Power Amplifier‌

Such as the LTC6910 series, it provides high driving capability and is commonly found in portable devices and consumer electronics products. It is necessary to pay attention to the packaging form (such as SOT23-8) and the power supply voltage range.

 

3. ‌Interface and Communication Protocol of Audio Special Purpose ICs‌

‌Digital Interface Type‌

Includes I²S (mainstream audio data transmission bus), PCM (mostly used for data conversion between subsystems), and PDM (microphone recording scenarios). Among them, I²S supports left and right channel separation transmission and can work efficiently with the main control chip.

 

‌Control Interface‌

Such as the I²C bus, used for parameter configuration (such as volume adjustment).

 

4. What are Audio Special Purpose ICs Used for?‌‌

‌Consumer Electronics‌: audio processing of headphones, smart speakers, mobile phones, and other devices.

‌Automotive Electronics‌: Car audio, voice assistant, etc.

‌Industry and Communications‌: Conference systems, signal processing of voice recognition equipment.

 

5. ‌Design Points for Audio Special Purpose ICs‌

‌Power Supply and Wiring‌: Short and wide power leads should be used to reduce impedance and avoid power ripple affecting sound quality.

‌Interface Layout‌: It is recommended to place peripheral interfaces such as headphone jacks on the edge of the PCB for easy plugging and unplugging. At the same time, attention should be paid to the isolation of power supply pins (such as +5V power lines to avoid misconnection).

‌Anti-interference‌: The analog signal path needs to be separated from the digital signal to reduce crosstalk.