AUDIO A2B TRANSCEIVR 1CH 32LFCSP
2-WIRE SERIAL INTERFACE LENS DRI
IC VOLUME CONTROL 16DIP
IC AUDIO TONE PROCESSOR 20SSOPA
UNI-DIRECTIONAL VCM DRIVER FOR A
IC LINE DRIVER 28TSSOP
IC VOLUME CONTROL 28SOIC
IC VOLUME CONTROL 16DIP
IF SIGNAL PROCESSOR (VIF + SIF)
IC AUDIO SIGNAL PROCESS 48VQFN
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Mfr.Part #
In Stock
Manufacturer
Description
Package
AD2427WCCSZ AD2427WCCSZ 29907 Analog Devices Inc. AUDIO A2B TRANSCEIVR 1CH 32LFCSP 32-WFQFN Exposed Pad, CSP
BU64244GWZ-TR BU64244GWZ-TR 30191 Rohm Semiconductor 2-WIRE SERIAL INTERFACE LENS DRI 6-XFBGA, CSPBGA
PGA2310PA PGA2310PA 36566 Texas Instruments IC VOLUME CONTROL 16DIP 16-DIP (0.300", 7.62mm)
BD37513FS-E2 BD37513FS-E2 34496 Rohm Semiconductor IC AUDIO TONE PROCESSOR 20SSOPA 20-SOP (0.213", 5.40mm Width)
BU64292GWZ-TR BU64292GWZ-TR 43269 Rohm Semiconductor UNI-DIRECTIONAL VCM DRIVER FOR A 6-XFBGA, CSPBGA
DIT4192IPW DIT4192IPW 14321 Texas Instruments IC LINE DRIVER 28TSSOP 28-TSSOP (0.173", 4.40mm Width)
PGA4311UA PGA4311UA 863 Texas Instruments IC VOLUME CONTROL 28SOIC 28-SOIC (0.295", 7.50mm Width)
PGA2311P PGA2311P 4288 Texas Instruments IC VOLUME CONTROL 16DIP 16-DIP (0.300", 7.62mm)
LA75676VA-TLM-E LA75676VA-TLM-E 1539 Sanyo IF SIGNAL PROCESSOR (VIF + SIF) Bulk
CMX7158Q3 CMX7158Q3 31513 CML Microcircuits IC AUDIO SIGNAL PROCESS 48VQFN 48-VFQFN Exposed Pad

Audio Special Purpose

1. What are Audio Special Purpose ICs?‌

Audio Special Purpose ICs are integrated circuits designed for audio signal processing, including core functional modules such as audio codec (CODEC), digital signal processor (DSP), amplifier, mixer, etc., covering the entire link of audio signal acquisition, conversion, processing, and output. This type of chip achieves application requirements such as high-definition voice capture and multi-channel output through analog signal input, A/D conversion, digital processing (such as noise reduction and equalization), and D/A conversion.

 

2. What are the ‌Main Types of Audio Special Purpose ICs?‌

‌Audio Codec (CODEC)‌

Mainly responsible for analog-to-digital conversion (ADC) and digital-to-analog conversion (DAC), which directly affects the quality of analog input and output. For example, the AC107 chip supports multi-microphone array input and is suitable for speech recognition scenarios.

 

‌Digital Signal Processor (DSP)‌

Performs complex algorithm processing on digital audio, such as filtering, sound enhancement, etc. Some high-end models integrate independent programmable microphone bias voltage and amplifier.

 

‌Automotive Audio Processor‌

Optimized for the in-vehicle environment, such as BD37033FV-ME2 and BD37069FV-ME2 support multi-channel output (such as 6 channels), covering power management, interface control, and other functions, and adapting to the low noise and high-reliability requirements of the automotive audio system.

 

‌Power Amplifier‌

Such as the LTC6910 series, it provides high driving capability and is commonly found in portable devices and consumer electronics products. It is necessary to pay attention to the packaging form (such as SOT23-8) and the power supply voltage range.

 

3. ‌Interface and Communication Protocol of Audio Special Purpose ICs‌

‌Digital Interface Type‌

Includes I²S (mainstream audio data transmission bus), PCM (mostly used for data conversion between subsystems), and PDM (microphone recording scenarios). Among them, I²S supports left and right channel separation transmission and can work efficiently with the main control chip.

 

‌Control Interface‌

Such as the I²C bus, used for parameter configuration (such as volume adjustment).

 

4. What are Audio Special Purpose ICs Used for?‌‌

‌Consumer Electronics‌: audio processing of headphones, smart speakers, mobile phones, and other devices.

‌Automotive Electronics‌: Car audio, voice assistant, etc.

‌Industry and Communications‌: Conference systems, signal processing of voice recognition equipment.

 

5. ‌Design Points for Audio Special Purpose ICs‌

‌Power Supply and Wiring‌: Short and wide power leads should be used to reduce impedance and avoid power ripple affecting sound quality.

‌Interface Layout‌: It is recommended to place peripheral interfaces such as headphone jacks on the edge of the PCB for easy plugging and unplugging. At the same time, attention should be paid to the isolation of power supply pins (such as +5V power lines to avoid misconnection).

‌Anti-interference‌: The analog signal path needs to be separated from the digital signal to reduce crosstalk.