Wave soldering temperature profile
This article explains the importance of wave soldering temperature profile to welding quality and production efficiency from its composition, function, purpose, and optimization method.
Wave soldering temperature profile
Wave soldering temperature profile
The wave soldering temperature profile refers to the printed circuit board's time and temperature curve when
processing in the wave soldering equipment.
It is a vital parameter in the wave soldering process and will directly affect soldering quality and
production efficiency.

Composition of wave soldering temperature curve
The wave soldering temperature curve generally consists of the following parts:
Preheating area: This zone is used to evenly heat the circuit board and components to
ensure that the solvent elements of the flux are volatilized by heat to avoid explosion and tin particle
problems.
Soldering area: This area is used to melt the solder so that it wets and fills the
solder joint, forming a fixed solder connection.
Cooling zone: This zone is used to cool and solidify the solder and prevent defects in
the solder joints.

Purpose and function of wave soldering temperature curve
Welding quality control: Wave soldering temperature curve is a significant basis for
welding quality control.
Optimizing the wave soldering temperature curve can improve the soldering quality and reduce soldering
defects.
Improved production efficiency: Optimization of wave soldering temperature curve can
shorten soldering time and improve production efficiency.
Cost control: Optimization of wave soldering temperature curves can reduce welding
defects, reduce scrap rate, and thus reduce costs.
Optimization of wave soldering temperature curve
Optimize the wave soldering temperature curve from the following aspects:
Choose the right temperature and time:
If the preheating temperature is too low, the solvent components of the flux will not
be completely volatilized, resulting in bubbles and tin particles. If the preheating temperature is too
high, it will cause damage to the components.
If the preheating time is too short, the solvent components of the flux will not be
completely volatilized, resulting in bubbles and tin particles. If the preheating time is too long, the
circuit board and components will overheat, thus affecting the welding quality.
If the soldering temperature is too low, the solder will not be able to fully wet the
pads and components, resulting in cold soldering. If the soldering temperature is too high, the solder
will expand excessively, resulting in bridging and pores.
If the soldering time is too short, the solder will not fill the solder joint,
resulting in cold soldering. If the soldering time is too long, the solder will expand excessively,
resulting in bridging and pores.
Too low a cooling temperature will cause poor solidification of the solder, resulting
in cold soldering. Too high a cooling temperature will cause excessive shrinkage of the solder,
resulting in pores.
If the cooling time is too short, the solder will not solidify properly, resulting in
cold solder joints. If the cooling time is too long, the solder will shrink excessively, resulting in
pores.
Share a wave soldering temperature setting parameter.
1. The peak temperature range is 255°C~265°C
2. The preheating temperature is 90°C~120°C
3. The warm-up time is 80sec~150sec
4. The heating slope is 1~3°C/sec
5. Soldering time: disturbance wave + flat wave = 3 sec~5 sec
6. The cooling slope depends on each cooling system and is generally acceptable at 5-12°C/sec.
Use optimization method
Experimental method: Through experiments, gradually adjust the welding temperature
curve to obtain the best welding effect.
Simulation method: Use simulation software to simulate the welding effects under
different welding temperature curves to guide the actual welding process.
Data analysis method: By analyzing historical data, find the factors affecting welding
quality and optimize the welding temperature curve accordingly.
Future Development of Wave Soldering Temperature Curve
With the continuous development of electronic products, the requirements for wave soldering temperature
curves are getting higher and higher.
In the future, the wave soldering temperature curve will develop in the following directions:
More intelligent: Through technologies such as artificial intelligence and machine
learning, we can achieve automatic optimization of wave soldering temperature curves.
More environmentally friendly: Using more environmentally protection-friendly solder
and flux can reduce the environmental effect.
More energy-saving: reduce welding energy consumption by optimizing the welding
process.
Conclusion
The wave soldering temperature curve is a significant parameter in the wave soldering process. It can
directly impact soldering quality and production efficiency.
Optimizing the wave soldering temperature curve can improve the soldering quality and reduce the cost,
increasing the production efficiency.