What Is The Direction of The SMT Equipment Upgrade?

With the continued miniaturization of electronic products and the increasing integration of integrated circuits (ICs) and central
processing units (CPUs), the manufacturing industry faces urgent needs for transformation and upgrading.
Electronic product design is constantly innovating, and intelligence and automation have gradually
become the mainstream direction of enterprise development.

Surface mount technology

Surface mount technology (SMT), as a representative of the new generation of electronic
assembly technology, has experienced rapid development in the past decade and has been widely used in
many fields. Its technical advantages have allowed SMT to partially or completely replace traditional
through-hole technology in many fields.

This process can be roughly divided into printing, SMT, welding, and testing. With its
characteristics and advantages, SMT technology has achieved radical and revolutionary changes in
electronic assembly technology.

High-precision automatic printing, good first pass for SMT production

As the initial process of surface mount technology (SMT), the printing link has a significant impact on
the qualification rate of SMT products. Among them, the high precision of the motion control part of the
printing press is one of the key factors affecting the quality of welding paste printing.

Currently, SMT products are moving towards the goals of high output and "zero defects". During
the production process, printing machines must achieve stable, continuous high-speed printing operations
for a long time. This requires that the operating speed, stability, and reliability of the motion
control system reach extremely high standards, and the innovative technologies of printing component
manufacturers continue to push the limits of production quality and production efficiency.

Focus on full-line SMT production, SMT placement machines with high performance, high
efficiency, and high integration.

This placement machine is designed to achieve high-speed, high-precision automatic placement of
components, which has a decisive impact on the accuracy and efficiency of the placement production line.
The patch production line is one of the most stringent areas in terms of equipment requirements, and its
key technologies and stability play a vital role in the investment in the entire production line.

The development trend of placement machines can be summarized as the "three
highs" – high availability, high performance, high efficiency, and the "four highs" –
high integration, flexibility, intelligence, greenness, and diversification. As electronic devices
continue to be miniaturized, the demand for high functionality, high density, and complex mounting forms
is growing. In particular, the requirements for SMD and semiconductor hybrid mounting have become more
stringent.

High quality and green environmental protection, SMT reflow attaches great importance to energy
saving and environmental protection.

SMT reflow welding technology involves pre-forming welding joints on the welding surface without adding
additional welding during the welding process. This technology uses a heating circuit inside the device
to heat air or nitrogen to a high temperature and then acts on the circuit board with mounted
components. Welding components are bonded to the motherboard under high temperatures, and this
technology has become mainstream in the SMT field. Through this process, most of the components on the
circuit board are welded into place.

In recent years, with the vigorous development of smart terminal devices, packaging technology tends to
be miniaturized and high-density assembly. With the continuous emergence of new packaging technologies,
the quality requirements for circuit assembly are also increasing.

Compared with traditional manual inspection methods, automatic optical inspection, ICT
testing, functional testing (FCT) and first-piece inspection technology, X-RAY technology has
demonstrated its unique advantages and has therefore gained significant popularity in surface mount
technology (SMT), luminescence Diode (LED), ball grid array (BGA), chip size package (CSP) flip chip
inspection, semiconductor packaging components, lithium battery industry, electronic components, auto
parts, photovoltaic industry aluminum, die castings, molded plastics, ceramic products It has been
widely recognized and used in detection applications in many special industries.

Shenzhen Highqualitypcb SMT manufacturer: X-RAY inspection equipment, including
two-dimensional and three-dimensional systems, are based on the basic principles of X-ray projection
microscopes. These devices can significantly improve the performance of the inspection system, thereby
improving product qualification rates and striving to achieve the goal of "zero defects."
Especially in the first-piece inspection of SMT (Surface Mount Technology), they can quickly identify
and prevent potential large-scale defective or scrap problems, thus having a positive impact on product
quality.