DIP section SMT supervision focus and exception handling

By Published On: 2025-04-27

This article describes the focus of SMT IPQC supervision in the DIP segment and abnormal handling from solder printing and welding quality, and component placement position.

DIP section SMT supervision focus and exception handling

1.Solder paste printing quality.

The quality of solder paste printing is one of the significant quality indicators of SMT assembly, and
it directly affects the quality of component welding.

The main manifestations of abnormal solder paste printing quality are:

Solder paste voids: Solder paste does not fill the PCB, forming voids.

Solder paste voids | SMT pick and place machine | SMT assembly | Highqualitypcb

Solder paste overflow: The solder paste overflows on the PCB, affecting component soldering.

Uneven distribution of solder paste: The solder paste is unevenly distributed on the PCB, affecting
component soldering.

The main reasons for abnormal solder paste printing quality are :

• Set improperly the solder paste printer parameters.

• The solder paste printer is not clean enough.

• Poor solder paste quality.

How to deal with abnormal solder paste printing quality:

• Adjust the parameters of the solder paste printer.

• Clean the solder paste printer.

• Replace solder paste.

2.Component mounting position

Component placement position is one of the vital quality indicators of SMT assembly, which directly
affects product performance and reliability.

The main manifestations of abnormal component placement positions are:

Offset: The component deviates from the specified position.

Misalignment: The component position does not match the specified position.

Missing placement: The component is not mounted.

offset | SMT pick and place machine | SMT assembly | Highqualitypcb

The main reasons for abnormal component placement are:

• Setting improper placement machine parameters.

• The SMT pick and place machine is not clean enough.

• Poor component quality.

How to deal with abnormal component mounting position:

• Adjust the placement machine parameters.

• Clean the placement machine.

• Replace components.

3.Component welding quality

Component welding quality is one of the significant quality indicators of SMT, which directly affects
product performance and reliability.

The main manifestations of abnormal component welding quality are:

Cold solder joint: The soldering point has insufficient solder, and the welding strength is
insufficient.

Open solder joint: The solder falls off.

cold soldering | SMT pick and place machine | SMT assembly | Highqualitypcb

The main reasons for abnormal component welding quality are:

• The welding furnace parameters are not set correctly.

• The welding furnace is not clean enough.

• Poor component quality.

How to deal with abnormal component welding quality:

• Adjust the welding furnace parameters.

• Clean the welding furnace.

• Replace components.

4.Prevention first

In SMT IPQC supervision focus and abnormal handling, prevention is the most crucial principle.

Only by strengthening the monitoring of solder paste printing, component placement, and welding quality
can we discover problems in time and take measures to correct them. It effectively prevents the
occurrence of quality problems.

5.Quick response

When we discover any abnormality, we should take measures promptly to deal with it and prevent the
problem from escalating.

If not handled promptly, it may lead to quality problems in batches of products and even cause product
recalls.

6.Record tracking

All abnormal situations should be recorded, tracked, analyzed, and summarized to prevent similar
problems from happening again.

By analyzing the causes of abnormalities, we can formulate corresponding preventive measures to improve
product quality.

By strengthening the supervision and control of DIP segment SMT, we can improve product quality, reduce
production costs, and ensure smooth production.

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