Products
Integrated Circuits
Clock/Timing
Data Acquisition
Embedded
Interface
Linear
Logic
Memory
Power Management (PMIC)
Connectors, Interconnects
AC Power Connectors
Backplane Connectors
Banana and Tip Connectors
Barrel Connectors
Blade Type Power Connectors
Card Edge Connectors
Circular Connectors
Coaxial Connectors (RF)
Contacts
D-Sub, D-Shaped Connectors
FFC, FPC (Flat Flexible) Connectors
Fiber Optic Connectors
Filters
Relays
Surface mount technology (SMT) and traditional through-hole technology (THT) are the two main component assembly processes in electronic product assembly.
There are many differences between the two in terms of components, substrates, assembly processes, etc., which lead to different performance and application characteristics.
The fundamental difference between surface mount technology and through-hole technology is the components assembly way.
SMT is to mount components directly on the surface of the PCB that uses a pick and place machine, while THT is to insert leaded components into through holes on the PCB.
The components are small and lightweight, which reduces PCB space and weight.
High assembly density can realize electronic products with higher integration.
It has high production efficiency and can realize automated high-volume PCB assembly.
Components are large and heavy, requiring more PCB space and weight.
It has low assembly density and is hard to realize highly integrated electronic products.
The production efficiency is low and requires more manual operations.
There are specific differences between SMT and THT in the following aspects:
The PCB used in the Surface mount technology process needs to reserve pads, while the PCB used in the THT process needs to reserve through holes.
The components used in the SMT process are sheet components, while the parts used in the THT process are lead.
The components and solder joints of the Surface mount technology process are located on the same plane, while the components and solder joints of the THT process are located on both sides of the board.
The solder joints of the SMT are round or oval, while the solder joints of the through-hole technology are rectangular or diamond.
The Surface mount technology process uses a placement machine and an SMT reflow oven, while the through-hole technology process uses a plug-in machine and a wave soldering oven.
There are differences between the SMT and THT process's performance and application characteristics.
The performance advantages of surface mount technology are mainly in the following aspects:
Small and lightweight: The components used in the SMT are small and lightweight, which can effectively save PCB space and weight.
It is significant for electronic products that pursue lightness, thinness, and portability.
High assembly density: SMT technology can achieve higher component assembly density, thus realizing more highly integrated electronic products.
It is significant for electronic products that pursue high performance and functionality.
High production efficiency: SMT process can realize automated mass production, thereby improving production efficiency and reducing costs.
The SMT process has the advantages of high integration and high production efficiency, so it has been used widely in consumer electronics, communication equipment, and other fields.
For example, almost all electronic products, such as smartphones, tablet computers, and laptops, use SMT technology.
The performance advantages of the THT process are mainly in the following aspects:
High mechanical strength: The components and solder joints of the through-hole technology process are located on both sides of the PCB, which has good mechanical strength.
High reliability: The solder joints of the THT process use molten solder, which has high reliability.
It is significant for electronic products that need to work in harsh environments.
The THT process has good mechanical strength and reliability, So there is still demand in automotive electronics and the military. For example, parts need to endure vibration and impact in-car electronics. They use the through-hole technology process.
With the continuous development of electronic products, Surface mount technology will be more widely used in the future.
As technology advances, the cost of the SMT process will be reduced, making it more competitive.
The THT process will still have certain applications in some specific fields, but its application scope will gradually narrow.