SMT material baking: prevent welding defects and extend product life

Introduction

SMT mount processing is one of the significant processes in the manufacture of electronic products.

During the SMT patch processing, components and PCB boards may absorb moisture during storage and transportation.

Therefore, SMT baking is required before patch processing to remove moisture from the material.

Prevent defects such as bubbles, blistering, and board bursting during the welding to ensure product quality.

The primary purpose of SMT material baking is to remove moisture from the material to achieve the following effects:

• Prevent defects such as bubbles, blistering, and plate explosion during welding.

• Improve welding reliability

• Extend the life of the product

The steps for baking SMT materials are as follows:

Before baking, clean the SMT material to remove dust, dirt, and other impurities on the surface.

For fragile components, we should pay attention to packaging and transport.

Baking parameters include baking temperature, baking time, baking method, etc.

The baking temperature and time are determined according to the type of material and the storage environment.

Generally speaking, the PCB board baking temperature is 110℃-125℃, and the baking time is 2-8 hours;

The IC baking temperature is 125℃-150℃, and the baking time is 4-24 hours.

Evenly place the materials in the oven and keep a certain distance to allow hot air to circulate.

During the baking process, it is necessary to regularly observe the changes in the materials and discover abnormal conditions promptly.

The baking temperature and time should be determined according to the type of material and the storage environment.

Too high or too low baking temperature may cause damage to the material.

If the baking time is too long, the material may be too dry and will affect the welding effect.

The oven should be cleaned and maintained regularly to ensure baking results.

The oven should be free of debris to avoid affecting conduction heat.

Checked and calibrated the oven's temperature control system to ensure the accuracy of the baking temperature.

the oven should maintain a certain moisture to prevent the material from over-drying.

Keep a stable temperature in the oven to ensure the best baking effect.

SMT material baking is a significant process in SMT manufacturing and a crucial step to ensure product quality.

During the baking process, the process specifications should be strictly followed to ensure the baking effect.