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SMT assembly is a significant process in electronic products manufacturing, among which gluing and filling are the vital processes.
Gluing and pouring glue packages and protects electronic components, improves the product's waterproof, dustproof, and shockproof properties, and plays a role in heat conduction and insulation.
Gluing and pouring glue are two different processes.
Gluing means squeezing the glue directly to where it needs to be stuck while pouring glue means injecting the gum into the reserved space.
We use the gluing for bonding small areas. The pouring glue is used for bonding large areas or spaces that need to be filled.
There are two main methods of gluing in patch processing: dispensing and potting.
Glue dispensing is to squeeze glue through a needle or nozzle to the location where it needs to be bonded. The glue dispensing process is simple and suitable for small-batch production.
There are two main dispensing methods: contact dispensing and non-contact dispensing.
• Contact dispensing: The needle or nozzle directly contacts the surface of the adherend to squeeze out the glue.
The advantage of contact dispensing is that it is easy to operate. But it has low precision and is prone to bubbles.
• Non-contact dispensing: The needle or nozzle does not directly contact the surface of the adherend. It uses air pressure or vibration to squeeze out the glue.
Non-contact dispensing has higher precision. It is less likely to produce bubbles, but the operation is more complicated.
Potting is injecting glue into the reserved space.
The potting process is suitable for high-volume production. There are three main potting methods: manual, mechanical, and automatic.
• Manual potting: Use hand tools to inject glue into the reserved space. Manual potting has a lower cost but lower efficiency and is not easy to ensure accuracy.
• Mechanical potting: Use mechanical equipment to inject glue into the reserved space. Mechanical potting is more efficient but more expensive.
• Automatic potting: Use automatic equipment to inject glue into the reserved space. Automatic potting is the most efficient but also the most expensive.
Generally, gluing and filling the patch includes the following steps:
It includes cleaning the surface of the adherend, selecting the appropriate glue, and configuring the glue.
Gluing or pouring glue: Choose the appropriate gluing or pouring gum method according to your needs.
After curing the glue, check the gluing or pouring gum effect.
When gluing and filling the SMT mount, should pay attention to some notes:
• The surface of the adherend should be clean and dry, free of oil, dust, etc.
• The selected glue should meet the requirements of the adherend's material.
• When preparing glue, please strictly follow the instructions.
• When gluing or pouring gum, should operate specifications to avoid generating bubbles.
• After the glue is cured, we should check the gluing or filling effect to ensure that they meet the requirements.
SMT's gluing and pouring gum technology is widespread in electronic product manufacturing, mainly including the following aspects:
Encapsulation and protection of electronic components: Gluing and potting can effectively prevent electronic components from being damaged by water, dust, vibration, and other factors.
Improve the waterproof and dustproof performance of the product: Gluing and filling can effectively improve the waterproof and dustproof performance of the product. It extends the service life of the product.
Play the role of heat conduction and insulation: Gluing and pouring gum can play the role of heat conduction and insulation, thereby improving the product's performance.
Gluing and filling is one of the important processes in patch processing, which has a significant impact on the electronic product's performance and reliability.
When performing SMT gluing and pouring gum, we should strictly follow the process requirements to ensure the quality of gluing or gluing and improve the quality and reliability of the product.