Integrated Circuits - HighqualityPCB https://highqualitypcb.com PCB Manufacturing | PCB Assembly | PCB Board Fabrication is your trusted partner for high-quality PCB solutions. Experience precision engineering, quick turnaround times, and exceptional customer service. Wed, 12 Nov 2025 09:29:12 +0000 en-US hourly 1 https://wordpress.org/?v=6.8.5 https://highqualitypcb.com/wp-content/uploads/2025/05/cropped-logo-32x32.jpg Integrated Circuits - HighqualityPCB https://highqualitypcb.com 32 32 AGFB022R25A3E3E https://highqualitypcb.com/product/agfb022r25a3e3e/ Wed, 12 Nov 2025 09:28:57 +0000 https://highqualitypcb.com/product/agfb022r25a3e3e/
Mfr
Intel
Series
Agilex F
Package
Tray
Product Status
Active
Architecture
MPU, FPGA
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size
–
RAM Size
256KB
Peripherals
DMA, WDT
Connectivity
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed
1.4GHz
Primary Attributes
FPGA – 2.2M Logic Elements
Operating Temperature
0°C ~ 100°C (TJ)
Package / Case
–
Supplier Device Package
–
Number of I/O
624

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]]> AGIB027R29A1E2VR3 https://highqualitypcb.com/product/agib027r29a1e2vr3/ Wed, 12 Nov 2025 09:28:57 +0000 https://highqualitypcb.com/product/agib027r29a1e2vr3/
Mfr
Intel
Series
Agilex I
Package
Tray
Product Status
Active
Architecture
MPU, FPGA
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size
–
RAM Size
256KB
Peripherals
DMA, WDT
Connectivity
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed
1.4GHz
Primary Attributes
FPGA – 2.7M Logic Elements
Operating Temperature
0°C ~ 100°C (TJ)
Package / Case
–
Supplier Device Package
–
Number of I/O
720

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]]> AGFB008R24C2E1V https://highqualitypcb.com/product/agfb008r24c2e1v/ Wed, 12 Nov 2025 09:28:57 +0000 https://highqualitypcb.com/product/agfb008r24c2e1v/
Mfr
Intel
Series
Agilex F
Package
Tray
Product Status
Active
Architecture
MPU, FPGA
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size
–
RAM Size
256KB
Peripherals
DMA, WDT
Connectivity
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed
1.4GHz
Primary Attributes
FPGA – 764K Logic Elements
Operating Temperature
0°C ~ 100°C (TJ)
Package / Case
–
Supplier Device Package
–
Number of I/O
576

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]]> AGIB022R31B1E1V https://highqualitypcb.com/product/agib022r31b1e1v/ Wed, 12 Nov 2025 09:28:57 +0000 https://highqualitypcb.com/product/agib022r31b1e1v/
Mfr
Intel
Series
Agilex I
Package
Tray
Product Status
Active
Architecture
MPU, FPGA
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size
–
RAM Size
256KB
Peripherals
DMA, WDT
Connectivity
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed
1.4GHz
Primary Attributes
FPGA – 2.2M Logic Elements
Operating Temperature
0°C ~ 100°C (TJ)
Package / Case
–
Supplier Device Package
–
Number of I/O
720

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]]> AGFA027R24C3E4X https://highqualitypcb.com/product/agfa027r24c3e4x/ Wed, 12 Nov 2025 09:28:57 +0000 https://highqualitypcb.com/product/agfa027r24c3e4x/
Mfr
Intel
Series
Agilex F
Package
Tray
Product Status
Active
Architecture
MPU, FPGA
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size
–
RAM Size
256KB
Peripherals
DMA, WDT
Connectivity
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed
1.4GHz
Primary Attributes
FPGA – 2.7M Logic Elements
Operating Temperature
0°C ~ 100°C (TJ)
Package / Case
–
Supplier Device Package
–
Number of I/O
744

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]]> AGFB012R24C2E4X https://highqualitypcb.com/product/agfb012r24c2e4x/ Wed, 12 Nov 2025 09:28:57 +0000 https://highqualitypcb.com/product/agfb012r24c2e4x/
Mfr
Intel
Series
Agilex F
Package
Tray
Product Status
Active
Architecture
MPU, FPGA
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size
–
RAM Size
256KB
Peripherals
DMA, WDT
Connectivity
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed
1.4GHz
Primary Attributes
FPGA – 1.2M Logic Elements
Operating Temperature
0°C ~ 100°C (TJ)
Package / Case
–
Supplier Device Package
–
Number of I/O
744

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]]> AGFC019R25A2E4X https://highqualitypcb.com/product/agfc019r25a2e4x/ Wed, 12 Nov 2025 09:28:57 +0000 https://highqualitypcb.com/product/agfc019r25a2e4x/
Mfr
Intel
Series
Agilex F
Package
Tray
Product Status
Active
Architecture
MPU, FPGA
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size
–
RAM Size
256KB
Peripherals
DMA, WDT
Connectivity
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed
1.4GHz
Primary Attributes
FPGA – 1.9M Logic Elements
Operating Temperature
0°C ~ 100°C (TJ)
Package / Case
–
Supplier Device Package
–
Number of I/O
480

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]]> AGFB022R24C2I1V https://highqualitypcb.com/product/agfb022r24c2i1v/ Wed, 12 Nov 2025 09:28:30 +0000 https://highqualitypcb.com/product/agfb022r24c2i1v/
Mfr
Intel
Series
Agilex F
Package
Tray
Product Status
Active
Architecture
MPU, FPGA
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size
–
RAM Size
256KB
Peripherals
DMA, WDT
Connectivity
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed
1.4GHz
Primary Attributes
FPGA – 2.2M Logic Elements
Operating Temperature
-40°C ~ 100°C (TJ)
Package / Case
–
Supplier Device Package
–
Number of I/O
744

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]]> AGFA027R31C2E2V https://highqualitypcb.com/product/agfa027r31c2e2v/ Wed, 12 Nov 2025 09:28:30 +0000 https://highqualitypcb.com/product/agfa027r31c2e2v/
Mfr
Intel
Series
Agilex F
Package
Tray
Product Status
Active
Architecture
MPU, FPGA
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size
–
RAM Size
256KB
Peripherals
DMA, WDT
Connectivity
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed
1.4GHz
Primary Attributes
FPGA – 2.7M Logic Elements
Operating Temperature
0°C ~ 100°C (TJ)
Package / Case
–
Supplier Device Package
–
Number of I/O
720

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]]> AGFB019R25A2E3V https://highqualitypcb.com/product/agfb019r25a2e3v/ Wed, 12 Nov 2025 09:28:30 +0000 https://highqualitypcb.com/product/agfb019r25a2e3v/
Mfr
Intel
Series
Agilex F
Package
Tray
Product Status
Active
Architecture
MPU, FPGA
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size
–
RAM Size
256KB
Peripherals
DMA, WDT
Connectivity
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed
1.4GHz
Primary Attributes
FPGA – 1.9M Logic Elements
Operating Temperature
0°C ~ 100°C (TJ)
Package / Case
–
Supplier Device Package
–
Number of I/O
480

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]]>